Method of forming metal interconnection and method of fabricating semiconductor apparatus using the method

ABSTRACT

A semiconductor manufacturing method includes depositing a low-k dielectric layer, forming a trench in the low-k dielectric layer, forming a barrier layer in the trench, filling a metal on the barrier layer, planarizing the metal, and forming a capping layer on the planarized metal, wherein the capping layer includes at least two layers.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No. 10-2016-0060210, filed on May 17, 2016, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.

BACKGROUND 1. Field

One or more embodiments relate to a method of forming a metal interconnection and a method of fabricating a semiconductor device in the semiconductor device manufacturing apparatus using the method.

2. Description of the Related Art

As the size of semiconductor device shrinks, a response time of the semiconductor device slows down due to line resistances of metal interconnections in wiring structures and dielectric constants of interlayer dielectric layers that surround the metal interconnections. Such problems are referred to as resistance-capacitance (RC) delay. In order to reduce RC delay, materials of the metal interconnections are changed from aluminum to copper with a resistance lower than that of aluminum and materials of the interlayer dielectric layers that surround the metal interconnections are changed to materials having lower dielectric constants.

According to the prior art, a SiCN layer is deposited on a wiring layer after a chemical-mechanical planarization (CMP) process. The SiCN layer prevents an etching gas (e.g., a dry etching gas) or water (H₂O) from penetrating into an interlayer dielectric layer having a porous structure and a low dielectric constant and is used as an etch-stop layer (ESL). Meanwhile, as the size of a device shrinks, there is a demand for a thinner SiCN layer. However, the thinner SiCN film (e.g. with a thickness less than 100 Å) results in a limitation in preventing moisture or water from penetrating into a sub-layer low-k film (due to the limitation of a dielectric constant, etc.).

SUMMARY

One or more embodiments include a method of depositing a thin film with a thickness that is less than that of an existing capping layer (i.e., a SiCN layer) and excellent hermetic properties for protecting a sub-layer low-k layer from water or moisture.

Additional aspects will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments.

According to one or more embodiments, a method of forming a metal interconnection includes: depositing a low-k dielectric layer; forming a trench in the low-k dielectric layer; forming a barrier layer in the trench; filling a metal on the barrier layer; planarizing the metal; and forming a capping layer on the planarized metal, wherein the capping layer includes at least two layers and has a thickness equal to or less than 100 Å.

The forming of the capping layer may include depositing a first nitride layer and a second nitride layer.

The depositing of the first nitride layer and the second nitride layer may include: depositing an aluminum nitride (AlN) layer; and depositing a silicon nitride (SiN) layer.

The AlN layer may be formed by using a plasma-enhanced atomic layer deposition (PEALD) method. The deposition of the AlN layer may include a plurality of cycles, wherein each of the plurality of cycles includes: supplying an aluminum (Al) source gas; supplying a purge gas; supplying a reactive gas and activating the reactive gas by using plasma; and supplying the purge gas, wherein the purge gas is continuously supplied to a reactive space during the plurality of cycles. The Al source gas may include trimethyl aluminum (Al(CH₃)₃ or TMA), and the reactive gas may include a gas mixture of nitrogen and hydrogen.

The SiN layer may be formed by using a pulsed plasma-enhanced chemical vapor deposition (pulsed-PECVD, P-PECVD) method. The deposition of the SiN layer may include a plurality of cycles, wherein each of the plurality of cycles includes: supplying a silicon (Si) source gas; supplying a purge gas; supplying a reactive gas and activating the reactive gas by using plasma; and supplying the purge gas, wherein the reactive gas, the purge gas, and the plasma are continuously supplied to a reactive space during the plurality of cycles.

The Si source gas may include a silane gas.

The Si source gas may include at least one from among SiH₄, bis(diethylamino) silane (BDEAS), and diisopropylamino silane (DIPAS).

The reactive gas may include a gas mixture of nitrogen and hydrogen.

A thickness of the SiN layer may be at least 30 Å.

The method may further include performing plasma processing during the deposition of the first nitride layer and the second nitride layer, wherein the performing of the plasma processing includes at least one cycle, wherein each of the at least one cycle includes: supplying a nitrogen-containing gas; activating the nitrogen-containing gas by using plasma; and supplying a purge gas, wherein a metal oxide on the metal is reduced into a metal due to the cycle.

The forming of the capping layer may be performed at a temperature ranging from about 250° C. to about 350° C.

The first nitride layer and the second nitride layer may be formed in-situ in a same reactor.

A ratio of a thickness of the AlN layer to a thickness of the SiN layer may range from 1:1.5 to 1:2.

When the capping layer including the AlN layer and the SiN layer is exposed for 17 hours at a temperature of 85° C. and a humidity of 85%, a change in a stress of a thin film may be equal to or less than 50 MPa.

A ratio of power of plasma supplied during the deposition of the AlN layer to power of plasma supplied during the deposition of the SiN layer may range from about 10:1 to 8:1.

According to one or more embodiments, a method of manufacturing a device in a semiconductor apparatus includes: depositing a low-k dielectric layer; forming a trench in the low-k dielectric layer; forming a barrier layer in the trench; filling copper on the barrier layer to form a copper layer; planarizing the copper layer; applying plasma to the planarized copper layer; forming an aluminum nitride (AlN) layer on the planarized copper layer by using a plasma-enhanced atomic layer deposition (PEALD) method; and forming a silicon nitride (SiN) layer on the AlN layer in-situ in a reactor in which the AlN layer has been formed, wherein a sum of a thickness of the AlN layer and a thickness of the SiN layer ranges from about 50 Å to about 100 Å, wherein the forming the AlN layer and the forming of the SiN layer are performed at a temperature ranging from about 250° C. to about 350° C.

According to one or more embodiments, a method of manufacturing a device in a semiconductor apparatus includes: forming a first dielectric layer; forming a first metal layer in the first dielectric layer; and forming a capping layer with a thickness less than 100 Å on the first dielectric layer and the first metal layer, wherein the forming of the capping layer includes: forming an aluminum nitride layer; and forming a silicon nitride layer on the aluminum nitride layer.

According to one or more embodiments, a semiconductor device manufactured in a semiconductor apparatus includes: a first metal layer; a first dielectric layer surrounding a side surface of the first metal layer; an aluminum nitride layer contacting at least a part of the first metal layer and the first dielectric layer; a silicon nitride layer on the aluminum nitride layer; a second metal layer contacting a top surface of the first metal layer, a side surface of the aluminum nitride layer, and a side surface of the silicon nitride layer; and a second dielectric layer surrounding a side surface of the second metal layer, wherein a sum of a thickness of the aluminum nitride layer and a thickness of the silicon nitride layer is less than 100 Å.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings in which:

FIGS. 1 through 8 are cross-sectional views for explaining a method of forming a metal interconnection, according to embodiments;

FIG. 9 is a flowchart of a method of forming a metal interconnection and a method of manufacturing a device in a semiconductor manufacturing apparatus according to embodiments;

FIG. 10 is a timing diagram for explaining a method of forming a metal interconnection and a method of manufacturing a device in a semiconductor manufacturing apparatus according to embodiments;

FIGS. 11 through 12 are cross-sectional views for explaining a method of forming a metal interconnection according to other embodiments; and

FIG. 13 is a diagram for explaining an experiment for determining whether a double-layer structure has appropriate hermetic properties on a substrate according to an embodiment.

DETAILED DESCRIPTION

The present disclosure will now be described more fully with reference to the accompanying drawings, in which embodiments of the present disclosure are shown.

The present disclosure now will be described more fully hereinafter with reference to the accompanying drawings. The present disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to one of ordinary skill in the art.

The terminology used herein is for the purpose of describing embodiments only and is not intended to be limiting of embodiments of the present disclosure. As used herein, the singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises”, “comprising”, “includes”, and/or “including”, when used herein, specify the presence of stated features, integers, steps, operations, elements, components, and/or groups, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used here, the term “and/or” includes any and all combinations of one or more of the associated listed items.

It will be understood that although the terms “first”, “second”, etc. may be used herein to describe various members, regions, layers, and/or portions, these members, regions, layers, and/or portions should not be limited by these terms. The terms do not refer to a specific order, a vertical relationship, or a preference, and are only used to distinguish one member, region, or portion from another member, region, or portion. Accordingly, a first member, region, or portion which will be described below may refer to a second member, region, or portion without departing from the teaching of the present disclosure.

The present disclosure will now be described more fully with reference to the accompanying drawings, in which embodiments of the present disclosure are shown. In the drawings, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments should not be construed as limited to the particular shapes of regions illustrated herein but may be to include deviations in shapes that result, for example, from manufacturing.

Expressions such as “at least one of” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.

FIGS. 1 through 8 are cross-sectional views for explaining a method of forming a metal interconnection (and a method of manufacturing a semiconductor manufacturing apparatus), according to embodiments.

First, referring to FIG. 1, a circuit element 20 is formed on a substrate 10. Although the circuit element 20 has a simple quadrangular shape in FIG. 1, the circuit element 20 may have any of various other shapes. For example, the circuit element 20 may be a gate structure or a capacitor structure of a memory device, or may be a photodiode or a driving transistor of an image device. An insulating layer 30 may be formed around the circuit element 20.

Although the circuit element 20 protrudes from the substrate 10 in FIG. 1, the circuit element 20 may be a doped region formed in the substrate 10 or a structure (e.g., a buried gate structure) formed in the substrate 10. In this case, the insulating layer 30 may be an element included in the substrate 10.

Referring to FIG. 2, an interlayer dielectric layer 1 is formed on the circuit element 20. The interlayer dielectric layer 1 may be formed on the insulating layer 30. In an optional embodiment, the interlayer dielectric layer 1 and the insulating layer 30 may be formed at the same time. The interlayer dielectric layer 1 may be deposited so that the interlayer dielectric layer 1 has a thickness suitable for a via structure.

Referring to FIG. 3, the circuit element 20 is exposed by etching the interlayer dielectric layer 1. Although a via-hole structure including double trenches (i.e., a hole structure including an upper hole UH and a lower hole LH with different thicknesses) is illustrated in FIG. 3, the via-hole structure is not limited thereto. The via-hole structure may have a shape including a single trench or a shape including multiple trenches.

In order to form the via-hole structure including the double trenches, the following process may be used.

-   -   First step: A first photosensitive pattern having an opening         with a first width is formed on the interlayer dielectric layer         1.     -   Second step: The upper hole UH with the first width is formed by         a first etching (i.e. etching the interlayer dielectric layer 1         by using the first photosensitive pattern as a mask).     -   Third step: A second photosensitive pattern that contacts a side         wall of the upper hole UH and exposes a part of the bottom of         the upper hole UH is formed.     -   Fourth step: The lower hole LH with a second width is formed by         a second etching (i.e. etching the interlayer dielectric layer 1         by using the second photosensitive pattern as a mask), the         second width being less than the first width.     -   Fifth step: The second photosensitive pattern (and the first         photosensitive pattern) is removed.

The present disclosure is not limited to the above process, and any of other processes for forming the via-hole structure including the double trenches may be used. For example, a lower interlayer dielectric layer may be formed while the interlayer dielectric layer 1 is formed, an etch-stop layer having an opening with a second width may be formed on the lower interlayer dielectric layer, and then an upper interlayer dielectric layer may be formed on the etch-stop layer. In this case, when the upper interlayer dielectric layer is etched, the etch-stop layer and the opening with the second width are exposed, and the lower insulating layer under the etch-stop layer is not etched and the lower insulating layer under the opening with the second width is etched. Accordingly, an upper hole with a first width may be formed in the upper interlayer dielectric layer and a lower hole with the second width may be formed in the lower interlayer dielectric layer.

Referring to FIG. 4, a diffusion barrier layer 3 is formed on the via-hole structure including the double trenches. The diffusion barrier layer 3 may prevent a metal element of a via structure from diffusing into the interlayer dielectric layer 1. The diffusion barrier layer 3 may include at least one from among, for example, tantalum (Ta), tantalum nitride (TaN), titanium (Ti), titanium nitride (TiN), tungsten (W), tungsten nitride (WN), tantalum silicon nitride (TaSiN), titanium silicon nitride (TiSiN), and tungsten silicon nitride (WSiN).

Referring to FIG. 5, a metal layer 2 is formed on the diffusion barrier layer 3. The metal layer 2 may include, for example, copper, and may be formed of another metal material in consideration of a thermal expansion coefficient difference from an ambient material. Although not shown in FIG. 5, when the metal layer 2 is formed by using copper, a copper seed layer may be first formed on the diffusion barrier layer 3 and then the metal layer 2 may be formed by using the copper seed layer.

Referring to FIG. 6, a top surface of the metal layer 2 is planarized by removing a part of the metal layer 2 by using a planarization process. A chemical mechanical polishing (CMP) process may be used to planarize the top surface of the metal layer 2.

Referring to FIGS. 7 and 8, a capping layer having a double-layer structure may be formed on the planarized metal layer 2. The capping layer may prevent a dry etching gas, water (H₂O), oxygen (O₂), or soluble chemical species used in CMP from diffusing/penetrating into the interlayer dielectric layer 1 or a metal interconnection (e.g. a copper wiring) during a subsequent wiring process.

Once water or oxygen penetrates into the interlayer dielectric layer 1, a dielectric constant of the interlayer dielectric layer 1 may increase, RC delay may increase, and a response time of a device may slow down. According to the present disclosure, since the capping layer having the double-layer structure is used, such problems may be solved. Also, when an upper interlayer dielectric layer is formed on the lower metal layer 2 in order to form the capping layer including two metal layers, a metal component may be prevented from diffusing from the metal layer 2 to the upper interlayer dielectric layer 1 and the metal layer 2 may be prevented from corroding, owing to the capping layer of the double-layer structure.

The applicant has recognized that as a size of a device shrinks (and a thickness of a capping layer decreases), hermetic properties of a capping layer that includes an existing SiCN single layer against water or moisture decrease, and thus has invented a method of depositing a film with excellent hermetic properties even by using a capping layer with a thinner thickness.

The method may be performed by using the following process.

-   -   A first layer 4 is deposited on the metal layer 2 (see FIG. 7).     -   A second layer 5 is deposited on the first layer 4 (see FIG. 8).

A sum of thicknesses of the first layer 4 and the second layer 5 may be equal to or less than 100 Å. Also, each of the first layer 4 and the second layer 5 may be, for example, a nitride layer. Accordingly, the forming of the capping layer having the double-layer structure according to an embodiment may include depositing a first nitride layer and a second nitride layer. The first nitride layer and the second nitride layer may be sequentially deposited, and may be formed, for example, in-situ in the same reactor.

In an embodiment, the first layer 4 may be an aluminum nitride (AlN) layer and the second layer 5 may be a silicon nitride (SiN) layer. For example, the AlN layer may be formed by using plasma-enhanced (PEALD). Also, the SiN layer may be formed by using PEALD or pulsed plasma-enhanced chemical vapor deposition (P-PECVD). Accordingly, the forming of the capping layer may be performed at a low temperature ranging from, for example, about 250° C. to about 350° C.

In a PEALD method, a precursor and plasma may be alternately and intermittently supplied to a reactor repeatedly. In a P-PECVD method, plasma may be continuously supplied to the reactor and a precursor may be intermittently supplied.

FIG. 9 is a flowchart of a method of forming a metal interconnection and a method of manufacturing a device in a semiconductor manufacturing apparatus according to embodiments. The manufacturing method may be a modification of the manufacturing method according to the above embodiments, and a repeated explanation thereof will not be given.

Referring to FIG. 9, a process of forming a capping layer having a double-layer structure on the metal layer 2 may be performed as follows.

In operation S110, plasma processing is performed.

In operation S120, AlN is deposited by using PEALD.

In operation S130, SiN is deposited by using P-PECVD.

Operations S110 through S130 are continuously performed in-situ in a reactor at the same temperature ranging from about 250° C. to about 350° C.

First, operation S110, in which plasma processing is performed, is a step of reducing a metal oxide (e.g., a copper oxide (CuO)) formed on the metal layer 2 (e.g., a copper wiring interconnection) in a CMP process that is a front-end process into a metal (e.g., copper).

In the present disclosure, a gas mixture of ammonia (NH₃), nitrogen (N₂), and hydrogen (H₂) is supplied to a reaction space in which the substrate 10 is mounted and plasma is activated. Power of the plasma may range from about 50 W to about 300 W. As the plasma is activated, a metal oxide may be reduced and a process residue remaining on a surface of the planarized metal layer 2 (see FIG. 6) may be removed.

Operation S110 has a cycle including a step of activating plasma and a step of performing a purge process. In the present embodiment, the cycle is performed only once. However, an in an optional embodiment, the cycle may be performed a plurality of times.

A process condition in operation S110, in which the plasma processing is performed, is briefed as follows.

-   -   Process temperature: 250° C.-350° C.     -   Reactive gas: N₂/H₂/NH₃ (gas mixture)     -   Power of plasma: 100 W-300 W     -   Process pressure: 2 Torr-4 Torr     -   Process sequence: plasma ignition/purge     -   Repetition number: 1 cycle

Although a method of generating plasma in a reactive space is used in the present embodiment, according to an optional embodiment, plasma processing may be performed by generating active species by using remote plasma and the active species may be supplied into the reaction space.

Operation S120, in which AlN is deposited, is performed by using a PEALD method. In the present embodiment, trimethyl aluminum (Al(CH₃)₃ or TMA) is used as a aluminum (Al) source gas and a gas mixture of N₂/H₂ is used as a reactive gas. When operation S120, in which an AlN layer is deposited, has a cycle including a step of supplying TMA, a step of performing a purge process, a step of supplying plasma along with a gas mixture of N₂/H₂, and a step of performing a purge process, the cycle is repeatedly performed 18 times until the AlN layer has a thickness of 20 Å.

A process condition in operation S120, in which the AlN layer is deposited, is briefed as follows.

-   -   Process temperature: 250° C. to 350° C.     -   Source gas: TMA (trimethyl aluminum)     -   Reactive gas: N₂/H₂ (gas mixture)     -   Purge gas: argon (Ar)     -   Power of plasma: 200 W-400 W     -   Process pressure: 2 Torr-4 Torr     -   Process sequence: TMA supply/purge/plasma ignition/purge     -   Repetition number: 18 cycles (20 Å)

Although a method of generating plasma in a reactive space is used in the present embodiment, according to an optional embodiment, plasma processing may be performed by generating active species by using remote plasma and the active species may be supplied into the reaction space as described above.

Operation S130, in which SiN is deposited, is performed by using a P-PECVD method. In the present embodiment, silane (SiH₄) is used as a silicon (Si) source and a gas mixture of N₂/H₂ is used as a reactive gas. In the present embodiment, a reactive gas, a purge gas, and plasma are continuously supplied and SiH₄ is intermittently supplied. In a preferable embodiment, when one cycle is performed by supplying SiH₄ for 0.2 seconds and supplying a purge gas for 2 seconds, the cycle is repeatedly performed, for example, 50 times, until a thickness of a SiN layer is 30 Å.

A process condition in operation S130, in which the SiN layer is deposited, is briefed as follows.

-   -   Process temperature: 250° C.-350° C.     -   Source gas: SiH₄     -   Reactive gas: N₂/H₂ (gas mixture)     -   Purge gas: Ar     -   Power of plasma: 20 W-50 W     -   Process pressure: 2 Torr-4 Torr     -   Process sequence: SiH₄ supply/purge     -   Repetition number: 50 cycles (30 Å)

Although a method of generating plasma in a reaction space is used in the present embodiment, according to an optional embodiment, plasma processing may be performed by generating active species by using remote plasma and the active species may be supplied into the reaction space as described above. Also, although SiH₄ is used as a silane-based source gas in the present embodiment, any of other silane-based source gases may be used. That is, an aminosilane-based silicon source gas such as bisdiethylaminosilane (BDEAS), bisethylmethylaminosilane (BEMAS), or diisoprophylaminosilane (DIPAS), a silane chloride-based silicon source gas such as dichlorosilane (DCS), trichlorosilane (TCS), or hexachlorodisilane (HCD), or a combination thereof may be used as a source gas in operation S130.

In the above embodiment, since a capping layer having a double-layer structure of AlN/SiN is deposited, excellent hermetic properties against water or moisture may be ensured. Copper may be prevented from diffusing into a low-k interlayer dielectric layer and moisture may be prevented from penetrating into the low-k interlayer dielectric layer in a metal (copper) wiring process. That is, the applicant has found that, a thin AlN/SiN layer, instead of an existing thick SiCN layer, is realized and excellent hermetic properties against water or moisture are ensured, and the thin film of AiN/SiN with a thickness equal to or less than 100 Å that is required as a size of a device shrinks may be formed.

Also, in the above embodiment, since a plasma process, instead of an existing thermal process, is used at a low temperature, deformation of and damage to a sub-layer low-k dielectric layer may be minimized. Since a film is deposited by using a PEALD process, the film may be more finely and uniformly deposited than a film formed by using a CVD. A ratio of power of plasma for more efficiently achieving such effects is the same as a value obtained in the above embodiment. That is, power of plasma supplied during the depositing of the AlN layer ranges from about 200 W to about 400 W, and power of plasma supplied during the depositing of the SiN layer ranges from about 20 W to about 50 W. The inventor has found that it is optimal for a ratio of power of plasma supplied during the depositing of the AlN layer to power of plasma supplied during the depositing of the SiN layer to range from 10:1 to 8:1.

In addition, according to the above embodiment, since two layers are continuously deposited in-situ in one reactor, a film with excellent hermetic properties may be deposited without exposure to air and without deformation due to the exposure.

FIG. 10 is a timing diagram for explaining a method of forming a metal interconnection and a method of manufacturing a device in a semiconductor manufacturing apparatus according to embodiments. The manufacturing method may be a modification of the manufacturing method according to the above embodiments, and thus a repeated explanation thereof will not be given.

Referring to FIG. 10, operation S110 is a step of performing plasma treatment process during a period from a time t0 to a time t2. During operation S110, a metal oxide (e.g., a copper oxide) formed on a surface of a metal interconnection (e.g., a copper wiring) during a CMP front-end process is reduced into a metal element.

For example, a copper wiring may be used as the metal interconnection, and an inert purge gas (e.g., N₂) may be used as a reactive gas. In this case, a source gas (e.g., a precursor) may not be supplied.

In an optional embodiment, NH₃ may be supplied as a reactive gas and the reactive gas may be activated by using plasma to reduce a copper oxide. In this case, a purge gas may be supplied additionally.

Although operation S110 may be performed x times, operation S110 is performed only once in an embodiment.

Operation S120 is a step of performing a PEALD process during a period from the time t2 to a time t6. During operation S120, a precursor that is a source gas and a reactant (e.g., a reactive gas) may be sequentially supplied. In more detail, the source gas may be supplied during a period from the time t2 to a time t3 and the reactive gas may be supplied during a period from a time t4 to a time t5. A purge gas may be supplied during the period from the time t2 to the time t6.

As plasma is supplied during the period from the time t4 to the time t5, the reactive gas may be activated and the activated reactive gas may react with the source gas deposited to a thickness of an atomic layer level to deposit a film on the substrate 10. In an embodiment, during operation S120, an AlN layer may be deposited by using TMA as the source gas and a gas mixture of N₂ and H₂ or NH₃ as the reactive gas.

When steps performed during the period from the time t2 to the time t6 are referred to as one cycle, a plurality of atomic layers may be deposited by repeatedly performing the cycle m times. Preferably, an AlN layer with a thickness equal to or greater than 10 Å may be deposited by repeatedly performing the cycle. More preferably, an AlN layer may be formed to have a thickness ranging from about 20 Å to about 30 Å.

Although the reactive gas is supplied during the period from the time t4 to the time t5 (that is, after the time t4) during which the plasma is supplied in operation S120 of FIG. 10, the reactive gas may start to be supplied before the time t4 at which the plasma is supplied. Accordingly, a reactive gas density in a reaction space may become more uniform. Accordingly, since the reactive gas is supplied before the time t4, an active species density in the reaction space may become more uniform and properties (e.g., a wet etch rate ratio (WERR)) of a deposited film over the substrate may become more uniform.

In some embodiments, an inert gas such as Ar may be used as a purge gas. The purge gas may be continuously supplied to a reactor during the period from the time t2 to the time t6. In this case, as described above, a gas mixture of N₂ and H₂ or NH₃ may be supplied as a reactive gas.

In an optional embodiment, a nitrogen gas may be used as a purge gas. The nitrogen gas may be used as a reactive purge gas, and in this case, the nitrogen gas may be activated only when plasma is supplied and may react with a source gas to form an AlN layer.

Operation S130 is a step of depositing a SiN thin film by using a P-PECVD method. The deposition of the SiN thin film by using the P-PECVD method may be performed in-situ in the reactor in which operation S120 has been performed by using the PEALD method.

The AlN layer deposited in operation S120 may be oxidized when being exposed to air. Accordingly, the AlN/SiN layer may be deposited in-situ by continuously performing operation S130 in the same reactor. An AlN/SiN layer may be deposited by continuously performing operation S130 in the same reactor.

In operation S130, a reactive gas, a purge gas, and plasma are continuously supplied during a period from the time t6 to a time t10, whereas a source gas is intermittently supplied during a period from the time t6 to a time t7. When steps performed during the period from the time t6 to the time t10 are referred to as one cycle, a SiN thin film with a desired thickness may be deposited by repeatedly performing the cycle n times. In operation S130, a gas mixture of N₂ and H₂ or NH₃ may be used as the reactive gas. In an embodiment, a SiN thin film may be deposited to a thickness equal to or greater than 30 Å. In a preferable embodiment, a SiN thin film may be deposited to a thickness ranging from about 30 Å to about 60 Å.

Since the AlN layer may have a thickness ranging from about 20 Å to about 30 Å and the SiN thin film may have a thickness ranging from about 30 Å to about 60 Å as described above, a ratio of a thickness of the AlN layer to a thickness of the SiN layer may range from 1:1.5 to 1:2. However, a thickness of the AlN layer, a thickness of the SiN layer, and a ratio between the thicknesses above are conditions introduced to satisfy a process condition required in designing a device in which the film has to have a thickness of less than 100 Å and to have excellent hermetic properties (see FIG. 13). Accordingly, an individual thickness (i.e., a thickness of an individual layer) of a double-film structure according to the present disclosure is not limited thereto.

In an optional embodiment, during operations S110 through S130, a process temperature may be maintained at a low temperature ranging from about 250° C. to about 350° C. Accordingly, while a multi-metal layer structure is formed, damage to a sub interlayer dielectric layer (in particular, a low-k dielectric layer) may be prevented. Also, since plasma is applied during operations S110 through S130, a reaction time may speed up, a deposition rate may be higher than that of an existing thermal ALD process, and productivity per unit time may increase. Also, since a thin film with a thin thickness is deposited in cycles, thin film uniformity may be improved.

FIGS. 11 and 12 are cross-sectional views illustrating a metal interconnection of a device manufactured in a semiconductor apparatus according to other embodiments. A metal interconnection and a semiconductor device including the metal interconnection according to embodiments may be a structure formed by using the manufacturing method according to the above embodiments, and thus a repeated explanation thereof will not be given.

Referring to FIG. 11, a metal interconnection may be, for example, a copper wiring, and may be applied to a logic device or a memory device. The metal interconnection may include the interlayer dielectric layer 1 that is a low-k dielectric layer, the metal layer 2, the diffusion barrier layer 3, and a capping layer.

The interlayer dielectric layer 1 may be formed of a material having a low dielectric constant equal to or less than 2.5, and may include a tetraethyl orthosilicate (Si(C₂H₅O)₄ or TEOS)-based material (e.g., SiOC or SICOH). The interlayer dielectric layer 1 may have a porous structure. The interlayer dielectric layer 1 may surround side surfaces of the metal layer 2 and the diffusion barrier layer 3.

The diffusion barrier layer 3 may prevent a metal element of the metal layer 2 from diffusing and affecting film quality of the interlayer dielectric layer 1 as described above. The metal layer 2 is a wiring layer formed of aluminum or copper, and the diffusion barrier layer 3 and the metal layer 2 may be referred to as one element (e.g., the metal layer 2).

The capping layer may have a double-layer structure including the first layer 4 and the second layer 5 as described above, and may include a first nitride layer (e.g., an aluminum nitride layer) and a second nitride layer (e.g., a silicon nitride layer). The first layer 4 may contact at least a part (e.g., a top surface) of the metal layer 2 and the interlayer dielectric layer 1. The first layer 4 may directly contact the metal layer 2 and the interlayer dielectric layer 1 (that is, with no element therebetween). The second layer 5 may be located on the first layer 4. In an optional embodiment, since the first layer and the second layer are formed in-situ, the first and second layers 4 and 5 may directly contact each other.

FIG. 12 is a view illustrating a bi-layer wiring structure obtained by forming an additional wiring structure (i.e., a second metal layer 2′) on a wiring structure (i.e., the metal layer 2 (referred to as the first metal layer 2)) of FIG. 11.

Referring to FIG. 12, the second metal layer 2′ may be formed on the first metal layer 2. In more detail, for example, when the first layer 4 is an aluminum nitride layer and the second layer 5 is a silicon nitride layer, the second metal layer 2′ may contact a top surface of the first metal layer 2, a side surface of the aluminum nitride layer, and a side surface of the silicon nitride layer.

Although the second metal layer is denoted by 2′ in the present embodiment of FIG. 12, the metal layer (or the second metal layer) is not limited to 2′. For example, the second metal layer may be construed as including a diffusion barrier layer 3′ including metal as described above. In this case, the second metal layer may directly contact a top surface of the first metal layer 2, a side surface of the aluminum nitride layer, and a side surface of the silicon nitride layer.

FIG. 13 is a diagram for explaining an experiment for determining whether a double-layer structure has appropriate hermetic properties on a substrate according to an embodiment. The substrate includes a metal layer, a diffusion barrier layer, and an interlayer dielectric layer (including, for example, TEOS) according to the above embodiments. In particular, TEOS easily absorbs water. As TEOS absorbs water, a volume of the substrate increases and a compressive stress is generated (see portion FAIL at the bottom right).

In order to form a capping layer for preventing the permeation of water, when the capping layer is exposed for 17 hours in an atmosphere with a temperature of 85° C. and a humidity of 85%, a change in a stress of a substrate has to be less than 50 MPa. In general, as a thickness of a capping layer decreases, the capping layer is more vulnerable to the permeation of water. When a conventional SiCN capping layer has a thickness equal to or less than 100 Å, a condition that a change in a stress has to be less than 50 MPa is not satisfied.

However, according to embodiments, since a double-layer structure including different materials is used, a condition that a change in a stress has to be less than 50 MPa may be satisfied.

Table 1 shows a result obtained after evaluating hermetic properties of a double-layer structure (including AlN 20 Å/SiN 30 Å) according to an embodiment against water (H₂O) through the experiment of FIG. 13.

TABLE 1 Slot AlN SiN Si Change in No. thickness thickness precursor stress (ΔMPa) Pass/Fail 01 20 30 BDEAS −38 Pass 02 20 40 BDEAS −40 Pass 03 20 30 SiH₄ −4 Pass 04 20 40 SiH₄ −5 Pass

As shown in Table 1, hermetic properties of an existing SiCN layer with a thickness equal to or less than 100 Å degrade whereas a layer with a thinner thickness according to the present disclosure has excellent hermetic properties.

According to the one or more embodiments, instead of a SiCN film that is an existing capping layer, an AlN thin film is deposited and a SiN thin film is deposited on the AlN thin film. Due to such a double-layer structure, a capping layer may have a thickness of several nanometers which is less than that of the SiCN film and may ensure excellent hermetic properties.

Embodiments should not be construed as limited to the particular shapes of portions illustrated herein for better understanding of the present disclosure but may be to include deviations in shapes.

While one or more embodiments have been described with reference to the figures, it will be understood by one of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the following claims. 

What is claimed is:
 1. A method of forming a metal interconnection, the method comprising: depositing a low-k dielectric layer; forming a trench in the low-k dielectric layer; forming a barrier layer in the trench; filling a metal on the barrier layer; planarizing the metal; and forming a capping layer on the planarized metal, wherein the capping layer comprises at least two layers and has a thickness equal to or less than 100 Å, wherein the forming of the capping layer comprises depositing a first nitride layer and a second nitride layer, and wherein the depositing of the first nitride layer and the second nitride layer comprises: depositing an aluminum nitride (AlN) layer; and depositing a silicon nitride (SiN) layer, wherein a ratio of a thickness of the AIN layer to a thickness of the SiN layer ranges from 1:15 to 1:2, and wherein, when the capping layer comprising the AlN layers and SiN layer is exposed for 17 hours at a temperature of 85° C. and a humidity of 85%, a change in strees of a thin film is equal to or less than 50 MPa.
 2. The method of claim 1, wherein the AlN layer is formed by using a plasma-enhanced atomic layer deposition (PEALD) method.
 3. The method of claim 2, wherein the depositing of the AlN layer comprises a plurality of cycles, wherein each of the plurality of cycles comprises: supplying an aluminum (Al) source gas; supplying a purge gas; supplying a reactive gas and activating the reactive gas by using plasma; and supplying the purge gas, wherein the purge gas is continuously supplied to a reaction space during the plurality of cycles.
 4. The method of claim 3, wherein the Al source gas comprises trimethyl aluminum (Al(CH₃)₃ or TMA), and the reactive gas comprises a gas mixture of nitrogen and hydrogen.
 5. The method of claim 1, wherein the SiN layer is formed by using a pulsed plasma-enhanced chemical vapor deposition (P-PECVD) method.
 6. The method of claim 1, wherein a thickness of the SiN layer is at least 30 Å.
 7. The method of claim 1, wherein the first nitride layer and the second nitride layer are formed in-situ in the same reactor.
 8. A method of forming a metal interconnection, the method comprising: depositing a low-k dielectric layer; forming a trench in the low-k dielectric layer; forming a barrier layer in the trench; filling a metal on the barrier layer; planarizing the metal; and forming a capping layer on the planarized metal, wherein the capping layer comprises at least two layers and has a thickness equal to or less than 100 Å, wherein the forming of the capping layer comprises depositing a first nitride layer and a second nitride layer, wherein the depositing of the first nitride layer and the second nitride layer comprises: depositing an aluminum nitride (AlN) layer; and depositing a silicon nitride (SiN) layer, wherein the SiN layer is formed by using a pulsed plasma-enhanced chemical vapor deposition (P-PECVD) method, wherein the depositing of the SiN layer comprises a plurality of cycles, wherein each of the plurality of cycles comprises: supplying a silicon (Si) source gas; supplying a purge gas; supplying a reactive gas and activating the reactive gas by using plasma; and supplying the purge gas, and wherein the reactive gas, the purge gas, and the plasma are continuously supplied to a reaction space during the plurality of cycles.
 9. The method of claim 8, wherein the Si source gas comprises Si and H elements.
 10. The method of claim 9, wherein the Si source gas comprises at least one from among SiH₄, bis(diethylamino) silane (BDEAS), and diisopropylamino silane (DIPAS).
 11. The method of claim 8, wherein the reactive gas comprises a gas mixture of nitrogen and hydrogen.
 12. A method of forming a metal interconnection, the method comprising: depositing a low-k dielectric layer; forming a trench in the low-k dielectric layer; forming a barrier layer in the trench; filling a metal on the barrier layer; planarizing the metal; and forming a capping layer on the planarized metal, wherein the capping layer comprises at least two layers and has a thickness equal to or less than 100 Å, wherein the forming of the capping layer comprises depositing a first nitride layer and a second nitride layer, wherein the depositing of the first nitride layer and the second nitride layer comprises: depositing an aluminum nitride (AlN) layer; and depositing a silicon nitride (SiN) layer, wherein the SiN layer is formed by using a pulsed plasma-enhanced chemical vapor deposition (P-PECVD) method, wherein the method further comprises performing plasma processing before the deposition of the first nitride layer and the second nitride layer, wherein performing the plasma processing comprises at least one cycle, wherein each of the at least one cycle comprises: supplying a nitrogen-containing gas; activating the nitrogen-containing gas by using plasma; and supplying a purge gas, and wherein a metal oxide on the metal is reduced into a metal during the cycle.
 13. A method of forming a metal interconnection, the method comprising: depositing a low-k dielectric layer; forming a trench in the low-k dielectric layer; forming a barrier layer in the trench; filling a metal on the barrier layer; planarizing the metal; and forming a capping layer on the planarized metal, wherein the capping layer comprises at least two layers and has a thickness equal to or less than 100 Å, wherein the forming of the capping layer comprises depositing a first nitride layer and a second nitride layer, wherein the depositing of the first nitride layer and the second nitride layer comprises: depositing an aluminum nitride (AlN) layer; and depositing a silicon nitride (SiN) layer, wherein the SiN layer is formed by using a pulsed plasma-enhanced chemical vapor deposition (P-PECVD) method, and, wherein the forming of the capping layer is performed at a temperature ranging from about 250° C. to about 350° C.
 14. A method of forming a metal interconnection, the method comprising: depositing a low-k dielectric layer; forming a trench in the low-k dielectric layer; forming a barrier layer in the trench; filling a metal on the barrier layer; planarizing the metal; and forming a capping layer on the planarized metal, wherein the capping layer comprises at least two layers and has a thickness equal to or less than 100 Å, wherein the forming of the capping layer comprises depositing a first nitride layer and a second nitride layer, wherein the depositing of the first nitride layer and the second nitride layer comprises: depositing an aluminum nitride (AlN) layer; and depositing a silicon nitride (SiN) layer, wherein the SiN layer is formed by using a plasma-enhanced atomic layer deposition (PEALD) method, and wherein a ratio of power of plasma supplied during the depositing of the AlN layer to power of plasma supplied during the depositing of the SiN layer ranges from about 10:1 to 8:1.
 15. A method of manufacturing a semiconductor device, the method comprising: depositing a low-k dielectric layer; forming a trench in the low-k dielectric layer; forming a barrier layer in the trench; filling copper on the barrier layer to form a copper layer; planarizing the copper layer; applying plasma to the planarized copper layer; forming an aluminum nitride (AlN) layer on the planarized copper layer by using a plasma-enhanced atomic layer deposition (PEALD) method; and forming a silicon nitride (SiN) layer on the AlN layer in-situ in a reactor in which the AlN layer has been formed, wherein a sum of a thickness of the AlN layer and a thickness of the SiN layer ranges from about 50 Å to about 100Å, and wherein the forming the AlN layer and the forming of the SiN layer are performed at a temperature ranging from about 250° C. to about 350° C.
 16. A method of manufacturing a semiconductor device, the method comprising: forming a first dielectric layer; forming a first metal layer in the first dielectric layer; and forming a capping layer with a thickness less than 100 Å on the first dielectric layer and the first metal layer, wherein the forming of the capping layer comprises: forming an aluminum nitride layer; and forming a silicon nitride layer on the aluminum nitride layer, and wherein the aluminum nitride layer is located between the first metal layer and the silicon nitride layer; and forming a second dielectric layer on the said capping layer; forming a second metal layer in the said second dielectric layer; and forming a second capping layer with a thickness less than 100 Å on the second dielectric layer and the second first metal layer, wherein the forming of the second capping layer comprises: forming an second aluminum nitride layer; forming a second silicon nitride layer on the second aluminum nitride layer; and wherein a part of the second metal layer contacts the first metal layer and the side wall of the said first capping, layer. 